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On Friday, Honor announced through its official Weibo account that the company would hold a press conference for its new flagship product, Honor Magic V, on January 10 at 19:30 Beijing time. The device is to be equipped with Snapdragon 8 Gen 1 mobile platform.
The poster for the launch event shows that the Honor Magic V has adopted a silver back cover with vertical stripes, and the lens module will have three cameras positioned vertically on the rear of the phone body. The middle lens design is small, while the outer screen appears to have a hole dug in the center. The rear camera module, meanwhile, shows one lens in the middle of the three-camera setup to be smaller while the outer screen will be equipped with a front lens.
Zhao Ming, CEO of the Honor, also mentioned that the Magic V would be equipped with the thinnest hinge-patented technology developed by Honor while the Honor Magic UI 6.0 system would also be released with the Magic V at the event.
It was previously revealed that equipped with a 50-megapixel center perforated main camera, the flagship version of the device would have a built-in 5100mAh battery which will support 66W fast charging. The Magic V will also run a new version of the Magic UI 6.0 system based on Android 12.
Folding screens have overtaken the smartphone market in recent times as several companies have released their own take on the feature. Huawei recently launched its P50 Pocket folding screen smartphone while OPPO launched its Find N with a folding screen.